FC300 High Precision Die / Flip Chip Bonder
The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm.
The FC300 platform performs multiple applications including:
- High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging.
- Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly;
- UV-Curing for Adhesive Bonding
The tool features automated handling of chips and substrates up to 100 mm from waffle packs, plus a robotic option enabling chip picking from diced wafer and automated handling of larger substrates.
± 0.5 µm post-bonding accuracy and 20 µradians leveling guarantee highest quality for the most advanced products
Semi-Open Confinement Chamber for Oxide Reduction (option)
Bonding of devices up to 100 x 100 mm onto wafer up to 300 mm to enable large format assemblies
NIL configuration as add-on to bonding capability for maximum flexibility
Air bearing construction on a granite structure ensures long-term stability and reliability
Optional integrated chamber for gang reflow in a gas or vacuum environment
The FC300 accommodates a wide variety of materials, including extremely fragile materials such as GaAs and HgCdTe and processes:
Die Bonding (Face Up)
Flip Chip Bonding (Face to Face)
Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding
Thermocompression Bonding, Ultrasonic Bonding
UV-Curing Bonding, Adhesive Bonding
Chip-to-Chip, Chip-to-Wafer Bonding
3D Interconnect, Chip Stacking, Heterogeneous Integration
Optoelectronics Components and Photonics packaging
Nanoimprint Applications: Optics, Microfluidics, etc…
