FC300 High Precision Die / Flip Chip Bonder

The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm.

The FC300 platform performs multiple applications including:

  • High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging.
  • Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly;
  • UV-Curing for Adhesive Bonding

The tool features automated handling of chips and substrates up to 100 mm from waffle packs, plus a robotic option enabling chip picking from diced wafer and automated handling of larger substrates.

  ± 0.5 µm post-bonding accuracy and 20 µradians leveling guarantee highest quality for the most advanced products

  Semi-Open Confinement Chamber for Oxide Reduction (option)

  Bonding of devices up to 100 x 100 mm onto wafer up to 300 mm to enable large format assemblies

  NIL configuration as add-on to bonding capability for maximum flexibility

  Air bearing construction on a granite structure ensures long-term stability and reliability

  Optional integrated chamber for gang reflow in a gas or vacuum environment

Please use the form below to request  a datasheet (specify the model) or/and ask questions.

    The FC300 accommodates a wide variety of materials, including extremely fragile materials such as GaAs and HgCdTe and processes:

      Die Bonding (Face Up)

      Flip Chip Bonding (Face to Face)

      Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding

      Thermocompression Bonding, Ultrasonic Bonding

      UV-Curing Bonding, Adhesive Bonding

      UV-NILHot Embossing Lithography

      Chip-to-Chip, Chip-to-Wafer Bonding

      3D Interconnect, Chip Stacking, Heterogeneous Integration

      Optoelectronics Components and Photonics packaging


      Nanoimprint Applications: Optics, Microfluidics, etc…