FC150 Automated Die / Flip Chip Bonder

The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research and pilot production. With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder serves the industry’s most demanding bonding requirements. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable, cost-effective platform.

The FC150 supports a complete range of bonding applications, including ReflowThermo-compression, Thermosonic, Adhesive and Fusion bonding. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Able to level, align and bond components ranging in size from 0.2 to 100 mm, and engineered to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.

  ± 1 µm post-bond accuracy and 20 µradian leveling guarantee high yields on the most advanced products

  Semi-Open Confinement Chamber for Oxide Reduction (option)

  Air bearing construction on a granite structure ensures long-term stability and reliability

  Compression, Z-control and temperature profiling, together with process monitoring, maximize process control

  Optical automatic leveling and alignment enables hands-off operation for production applications

  Nanoimprint Lithography option with Hot Embossing or UV-NIL process without compromising the bonding capability

Please use the form below to request  a datasheet (specify the model) or/and ask questions.

    The FC150 accommodates a wide variety of materials, including extremely fragile materials such as GaAs and HgCdTe and processes:

      Die Bonding, Flip Chip Bonding

      Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding

      Thermocompression, Ultrasonic and Adhesive Bonding

      Gold, Gold/Tin, Indium, UV or Thermal Cure Adhesive, Polymers…

      Fragile Material Compatibility: InP, GaAs, MCT…

    Bond process changes are easily achieved.

      Chip-to-Chip, Chip-to-Substrate Bonding, Chip Stacking

      3D Interconnect

      Optical Components & Photonics Devices Packaging


      Nanoimprint Lithography: Aligned UV-NIL and Hot Embossing on Wafer