FC150 Automated Die / Flip Chip Bonder
The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research and pilot production. With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder serves the industry’s most demanding bonding requirements. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable, cost-effective platform.
The FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesive and Fusion bonding. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Able to level, align and bond components ranging in size from 0.2 to 100 mm, and engineered to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.