FC150 PLATINUM
FC150 PLATINUM Versatile Flip Chip Bonder
The high degree of flexibility offered on the FC150 Platinum makes it the machine of choice for advanced R&D and pilot line. With ± 0.5 µm placement accuracy and 0.7 µm post-bond accuracy, the SET FC150 Platinum Flip Chip Bonder serves the industry’s most demanding bonding requirements. With configurations ranging from manual Step by Step to full automation, the FC150 Platinum provides development and production capabilities on a single upgradeable, cost-effective platform.