ACCURA™ Plus : Dedicated to production for Optoelectronic and Silicon photonics applications.
The ACCµRA™ Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCµRA™ Plus combines high precision, flexibility and short cycle time.
*depending on configuration and application.
High accuracy and high throughput
Fully automatic
High flexibility and reliability
Ultra-small dies
Process Capabilities
Flip-chip bonding
Die bonding
Thermocompression
Reflow
UV curing
Gold, Gold/Tin, Indium, Copper
Pick & Place
Applications
Laser Diodes, Laser Bars
VCSEL, photo diode
LED
Prisms, Lenses, Mirrors
Micro Assembly
Flip-chip bonding, die bonding
Chip-to-chip, chip-to-substrate bonding
