ACCµRA™ OPTO: Optoelectronics and Silicon Photonics,
High Accuracy Flip-Chip Bonder 0.5 μm
The ACCµRA™ OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your process.
The ACCμRA™ Opto combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.
Highlights
- Post-bonding accuracy* (± 0,5 μm)
- Low Force Bonding
- Confining Gas
- Easy to use and very flexible
- Quick set-up of new applications
- Small footprint and compact design
*depending on configuration and application.
Open platform associated to an intuitive interface results in a quick set-up for new applications
Robust design and closed loop systems guarantee a high repeatability in operations
High precision, accurate control of low forces and user-friendly interface for multiple applications and processes.
Main bonding processes
Flip-chip bonding
Die bonding
Pick and place
Thermocompression
Reflow
UV curing
Gold, Gold/Tin, Indium, Copper
Laser diode, laser bar
VCSEL, photo diode
LED
Prisms, Lenses, Mirrors assembly
Micro assembly
Flip-chip bonding, die bonding
Chip-to-chip, chip-to-substrate bonding
Nanoimprinting (UV NIL and Hot Embossing)
