ACCµRA™ OPTO: Optoelectronics and Silicon Photonics,

High Accuracy Flip-Chip Bonder 0.5 μm

The ACCµRA™ OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your process.

The ACCμRA™ Opto combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.


  • Post-bonding accuracy* (± 0,5 μm)
  • Low Force Bonding
  • Confining Gas
  • Easy to use and very flexible
  • Quick set-up of new applications
  • Small footprint and compact design

*depending on configuration and application.

Open platform associated to an intuitive interface results in a quick set-up for new applications

Robust design and closed loop systems guarantee a high repeatability in operations

High precision, accurate control of low forces and user-friendly interface for multiple applications and processes.

Please use the form below to request  a datasheet (specify the model) or/and ask questions.

    Main bonding processes

    Flip-chip bonding

    Die bonding

    Pick and place



    UV curing

    Gold, Gold/Tin, Indium, Copper

    Main Applications

    Laser diode, laser bar

    VCSEL, photo diode


    Prisms, Lenses, Mirrors assembly

    Micro assembly

    Flip-chip bonding, die bonding

    Chip-to-chip, chip-to-substrate bonding

    Nanoimprinting (UV NIL and Hot Embossing)