ACCµRA™ M: New Manual Flip-Chip Bonder
The ACCμRA™ M is a manual flip-chip bonder that allows ± 3 μm accuracy.
This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.
The ACCμRA™ M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.
Highlights
- Accuracy* (± 3 μm)
- Process controlled thanks to closed loop systems
- Easy to use
- Granite structure offering high stiffness
- Vertical arm avoiding lateral shift during bonding
- Small footprint on open platform
*depending on configuration and application.
Open platform with simple user interface on touchscreen
Quick start for new applications
Superimposed images for easy manual alignment
Bonding controlled by the machine to guarantee a high repeatability from sample to sample.
Main bonding processes
Flip-chip bonding
Die bonding
Pick and place
Thermocompression
UV curing
Reflow
Gold, Gold/Tin, Indium, Copper
Micro assembly
Laser diode, laser bar
VCSEL, photo diode
LED
Flip-chip bonding, die bonding
Chip-to-chip, chip-to-substrate bonding
MOEMS, MEMS, MCM packaging…
