Conférences / Exhibitions

Exhibitions to which SETNA participate are shown below. Click on events for details.

ECTC 2023 | May 30-June 2, 2023 | Orlando, FL, USA

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Venue: ECTC 2023 – JW Marriott Orlando, Grande Lakes, Florida. Exhibition hours: Wednesday, May 31 >> 9:00 am – noon & 1:30 – 6:30 pm Thursday, June 1    >> 9:00 am – noon & 1:30 – 4:00 pm We shall be pleased to welcome you to the SET/SETNA Booth #437 to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High Accuracy Die / Flip Chip Bonding SETNA distribute the SET Corporation Bonders in North America. We shall be pleased to present the ACCµRA...

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SEMICON West, July 11-13, 2023, Moscone Center, San Francisco CA, USA

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SEMICON-West – Meet us on SET Corporation booth #461 (South Hall) Venue: Moscone Center, San Francisco, CA. Exhibition hours: 10:00am to 5:00pm on Tuesday, July 11. 10:00am to 5:00pm on Wednesday, July 12. 10:00am to 4:00pm on Thursday, July 13. High Accuracy Flip-Chip Bonders and Surface Preparation for Bonding using Atmospheric Plasma We shall be pleased to welcome you on the SET Booth to discuss accurate Die/Flip Chip bonding and surface preparation for bonding application and others.       High Accuracy Die / Flip...

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SEMICON Europe, Nov. 15-18, 2022, Munich, Germany

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SEMICON-Europa – Meet us on Booth C1-126 Venue:Messe München, Munich, Germany. Exhibition hours: 9:00am to 6:00pm on Tuesday, November 15. 9:00am to 6:00pm on Wednesday, November 16. 9:00am to 6:00pm on Thursday, November 17. 9:00am to 4:00pm on Friday, November 18.     Surface Preparation with Ontos Atmospheric Plasma We shall be pleased to discuss the Advantages of our Clean Atmospheric Plasma (Ontos) for Surface Preparation. It is applicable to numerous process steps for Semiconductor Manufacturing or Assembly. Ontos is...

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Quantum Computing: Metallurgy, Surface Preparation and Bonding for Cryogenic and Superconducting Hybrid Applications

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Hybrid chip interconnect utilizing Indium is well-known in the production of hybrid chip assemblies that must operate at cryogenic temperatures. This technology has been used for decades in the Infrared Focalplane industry. Recent developments in Quantum Computing technology have now shown that Indium is also an excellent candidate for hybrid chip assemblies that operate at superconducting temperatures in the milli-Kelvin temperature range. This Paper by the Quantum Computing groups at Google and UCSB describes the materials and processes...

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