Delta Printing System

DELTA Printing System

First truly additive method for printing single micron functional structures

Open Prototyping Platform, delivering reliable, repeatable, and durable results for high performance materials. Easy to operate and maintain. Ideal tool for R&D in various microelectronics applications.

Open platform for prototyping

  • Versatile technology for a range of R&D applications
  • Diverse resolutions
  • Expanding library of materials
  • Adjustable parameters
  • Continuous R&D innovations
Reliable, repeatable, and durable results for specific materials

  • Groundbreaking precision with high-resolution 3D printing (guaranteed 1 μm line printed during setup)
  • Extensive compatibility with high-resolution third-party inks
  • High precision and flawless uniformity in your printed traces
  • Unmatched electrical conductivity in printed traces, validated by pre-delivery and field-based proof-of-concept
Easy to operate and maintain

  • Seamless printing with our intuitive and simple-to-set printing parameters
  • Straightforward, rapid procedure for cartridge and nozzle installation
  • No need for post-printing cleanup
  • Delta design fits perfectly to any setting
  • System updates and development of new features
  • Feature sizes down to submicron scale
  • Wide range of material support
  • Printing on heterogeneous materials and 3D topographies
  • Uniform & clean feature geometries: no overspray, high linewidth homogeneity
  • Fast & easy exchange of cartridges & nozzles
  • Only 0.1 ml of ink required to start printing
  • Up to 100% ink utilization
  • Ultra-high-resolution printing on various substrates
  • High-viscosity materials along with small feature sizes
  • High aspect ratios just after a single pass
  • Wide range of printable materials: metallic nanoparticle inks and pastes, quantum dot inks, dielectrics, polymers, photoresists, organic, liquid metal alloys and more
  • Uninterrupted interconnections on highly complex topographies

Semiconductors

  • High precision with submicron feature size
  • A wide range of materials supported for varied semiconductor fabrication needs
  • High aspect ratios, ideal for conductive power interconnections
  • Quick process enhances efficiency and ensures uniform, reliable end products
  • Printing on complex 3D surfaces More-than-Moore devices

Flexible Hybrid Electronics

  • Superior precision for Flexible Hybrid Electronics manufacturing
  • Reliable 3D chip interconnections directly on vertical slopes
  • Conductive and non-conductive materials for complex circuit patterns and reliable interconnections
  • High aspect ratios in a single pass
  • Uniform, clean geometries promote FHE device performance and Radio Frequency (RF) capabilities

Biosensors

  • Biosensing pattern fabrication on flexible substrates, vital for wearable sensors
  • Functionalized materials to prototype biosensors targeted at specific markers
  • Unparalleled precision for swift biosensor prototyping
  • Ability to print

Displays

  • Ultra-high resolution printing for OLED and microLED displays
  • Precision ideal for interconnections, microcavity filling, and defect repair
  • Dispensing of various display architecture elements, such as color conversion layers and interconnectors
  • Single-step, high-precision additive process increases yield and reduces production time and costs

Printed Circuit Boards

  • A wide variety of materials facilitating specific PCB structure creation and integration
  • High aspect ratio structures in a single pass
  • Printing on complex 3D

Open defect repair

  • Dispensing ultra-high resolution features <1µm
  • Photonic sintering enabling resistance <1Ω/µm
  • Materials compatibility

Edge interconnections

  • Dispensing ultra-high resolution features <1µm
  • Photonic sintering enabling resistance <1Ω/µm
  • Materials compatibility

Microdots dispensing

  • Microdots printing
  • Excellent height to width aspect ratio
  • Capability to use conductive and non-conductive adhesives

Filling of microwells and TSV

  • Precise filling of microlavities, high aspect ratio vias, microwells
  • Variety of materials like: conductives, dielectrics, photoresist, quantum dots
  • Use-cases like QD color conversion, high-density TSV, RDL interconnection, sacrificial layer in MEMS fabrication

Printing through microchannels

  • Printing structures across dierent types of microchannels
  • Direct dispensing of conductive electrodes or photoresist (ex. SU-8)
  • Fast and reliable solution for microfluidic, med-tech and MEMS

Redistribution layer prototypying

  • All printed RDL structure
  • Down to 1µm / 1µm L/S density
  • Variable materials possible to use in one system, for example metalic nanoparticle paste and high viscous polyimide

3D micro-electronics printing

  • Directly on vertical step
  • No ramps needed
  • Reliable connection for flexible hybrid electronics and advanced IC packages

High-frequency structures

  • High resolution antenna on-chip
  • No satelite droplets and high uniformity to prevent high frequency signal loses
  • Wire-bonding interconnection alternative